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TH3044
K-Bus Interface
Pin Diagram
Open-emitter output with slew rate control Quiescent current < 50mA Bus voltage range -16 V .. +30 V ISO 9141 and OBDII compliant
SOIC14NB
1
14
NRXD RXD
2
13
GND VCC
3
12
4
TH3044
11
TxD SEN/STA
5
10
BUS
6
9
Wide temperature range -40 .. 125 C SOIC14 and SOIC8 package Baudrate 9600 Automotive applications
VBAT
7
8
SOIC 8
GND VCC BUS VBAT
1
8
N.C. RXD TxD SEN/STA
2
7
TH3044
3
6
4
5
Part No.
TH3044.2A
TH3044
Temperature Suffix
K ( -40C to +125C )
K ( -40C to +125C )
Package code
DC-14 ( SOIC14, 150mil )
DC-8 ( SOIC8 , 150mil)
The TH3044 is a bidirectional bus interface device for data transfer from 5V to 12V supply.For proper functionality control units are implemented.
This interface device was especially designed for automotive applications.
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TH3044
K-Bus Interface
All voltages are referenced to ground (GND). Positive currents flow into the IC. The absolute maximum ratings (in accordance with IEC 134) given in the table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do
so. Long term exposure to limiting values may affect the reliability of the device. Reliable operation of the TH3044 is only specified within the limits shown in "Operating conditions"
Operating Conditions
Parameter
Battery Voltage Supply Voltage Operating Temperature
Symbol
VBAT VCC TA
Min
6 4.5 -40
Typ
Max
16 5.5 125
Unit V V C
Absolute maximum ratings
Parameter
Battery Voltage Battery Current Supply Voltage Supply Current Input Voltage SEN/STA,TxD Input Current SEN/STA, TxD Input Voltage BUS Output Current RxD, NRxD Operating Temperature
Symbol
VBAT IBAT VCC ICC VIN IIN VINBUS IOUT TA
Condition
Min
-0.3
Max
30
Unit V
T 500 ms
40 20 7 10 -0.3 -10 -16 VCC+0.3 10 30 V 40 -10 -40 10 125 mA C mA V mA V mA
T 500 ms
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TH3044
K-Bus Interface
Static Characteristics
VDD= 4.5 to 5.5V, VBat = 6 to 16V, Tamb = -40C to +125C, unless otherwise specified
Parameter
Symbol Condition
Supply
Min
Typ
Max
Unit
Power-on-reset Threshold VCC Power-on-reset Threshold VBAT
VCCPOR VBATPOR VCC = 5V, VBAT = 12V, BUS, TxD, SEN/STA, RxD and NRxD open
3.0 3.0
4.0 4.5
V V
Quiescent Current, ICC + IBAT
ICCBAT
50
A
TxD, SEN/STA, RxD, NRxD
Pull-up Current TxD Pull-down Current SEN/STA Pull-up Current SEN/STA Input Voltage Low TxD, SEN/STA Input Voltage High TxD, SEN/STA Output Voltage Low RxD, NRxD Output Voltage High RxD, NRxD Ipu IpdSEN IpuSEN VIL VIH VOL VOH IOUT = 1 mA IOUT = 1 mA VCC -1.0 0.75 1 -330 170 -330 -250 250 -250 -170 330 -170 0.25 A A A VCC VCC V V
BUS
Input Voltage Low BUS Input Voltage High BUS Hysteresis Input Voltage VIL VIH VHYS VBAT = 0..40V Input Resistance BUS RIN VBAT = 0..40V, TA = 85C VBUS = 12V VBAT = 12V, SEN/STA = Low, IBUS = 40mA IBUS = 25mA Output Sinking Current BUS (current limiting) Output Sinking Current BUS (before fold back) ILIM IBUS VBUS > 3.5V 40 60 1.2 1.0 110 180 400 0.55 50 600 1500 1300 0.45 VBAT VBAT mV k k k V V mA mA
Output Voltage BUS
VBUS
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TH3044
K-Bus Interface
Dynamic Characteristics
Parameter
Propagation Delay TxD -> RxD, NRxD Threshold Voltage Fold-Back
Symbol
tpd VFB dV/dTfall
Condition
Min
Typ
Max
20 3.0
Unit
s V V/s V/s V/s s s s s ms ms
-2.2 1.0
-1.6 1.6
-1.0 2.2 0.3
Slew Rate BUS dV/dTrise Symmetry of Slew Rate BUS Debouncing Time BUS Symmetry of Debouncing Time BUS Bit-Compare Time BUS, SEN/STA, TxD Recover Time BUS, TxD Enable Time for transmit path BUS, TxD Constant-Low Time BUS, TxD dV/dTsym tdebH tdebL tdebsym tbc trec tena tlow 35 30 0.92 3 52 50 1.33 6 High or Low Pulse 1.5 2.8
4.0 0.5 70 75 1.8 12
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TH3044
K-Bus Interface
RxD
t DEB
Controllogic
POR VBAT
POR VCC
Bit-Compare Constant-Low
VthH VthL
NRxD
VCC
pnpControl
- slew rate - IB - foldback
BUS
TxD
ESD
VCC
OSC
Vref Biasing
SEN/STA
ESD
Figure 1 - Block Diagram
The TH3044 is used as a K-Bus interface. It builds the connection between the serial 5V bus line and the 12 V bus line. To avoid losses of data informations control functions are implemented.
Receive
The receiving path is always transparent. Independent of the mode the pin RxD and NRxD (inverted) are related to signal at the pin BUS. Voltage spikes on the bus signal are sup-pressed by the implemented debouncing circuit.
Transmit
During the transmission the data at the pin TxD will be transferred to the pin RxD (NRxD) as well as to the pin BUS.
SEN/STA
BUS
< tdebH
< tdebL
RxD
tdebH
tdebL
TxD
BUS
To minimise the electromagnetic emission of the bus line, the slew rate of the rising and falling edges of the data signals are limited.
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TH3044
K-Bus Interface
Bit Compare
Are the signals at the pin TxD and the pin BUS within a specified time t bc not identical, the transmission will be interrupted. If both signals at TxD and BUS are "High" within the time t ena the transmission will be enabled. To switch the TH3044 into the receive mode a low level "0" has to be applied to the pin Bus. If the TH3044 is part of a complex bus system the first device which transmits a low level "0" to the bus line forces all other TH3044 to switch into the receive mode. This state is valid until tena . The bitcompare-function is frequently retriggered by every new bit-comparison of two different levels. The bit-compare-function is activ when the pin SEN/STA is open (not overwritten).
TxD
Constant Low
A falling edge at pin TxD (from "1" to "0") starts the internal constant low timer. If the low level "0" is valid for the time t low the transmission unit of the TH3044 will be disabled. The receive unit is still active. A high level "1" at TxD with a minimum pulse width of t resets the constant low timer.
t < trec
TxD
SEN/STA
tlow
tena
BUS
tbc
Undervoltage
t < tbc
SEN/STA
tena
tena
Undervoltage at pin VBAT or pin VCC doesn't occur an unwanted low level at pin Bus (see chapter "Transmit")
SEN/STA
The pin SEN/STA is bidirectional. Used as an output the pin indicates whether the transmitpath is enabled or disabled: SEN/STA ="0" transmission path is enabled SEN/STA ="1" transmission path is disabled Using this pin as an input the transmission path can be overwritten (independent of bitcompare and constant-low function): SEN/STA="0" www..com forcing the transmission path free SEN/STA="1" disable the transmission path
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TH3044
K-Bus Interface
Connecting Supply Pin's
Connecting VBAT, VCC and GND in random sequence does not cause damaging of the device. The absence of VBAT-, VCC- or GNDconnection either alone or in any combination does not influence or disturb the bus.
Reverse Protection
To protect the TH3044 from reverse voltages, evers protection diode needs to be connected to pin VBAT.
EMC Filter
In order to minimise EMC radiation a LC filter (33 uH, 82 pF) is recommended. As an option a RC filter (10 , 100 pF) can be also used.
Reset
The pin BUS remains in tri-state, until internal RESET state is released.
VBat
TH3044
TH3044
TH3044
SEN/STA
VBAT
BUS pullups Rpu > 350
VBat
100n 2.2u
TH3044
TH3044
TxD
BUS
33uH 82p
100p...220p
MCU
RxD VCC NRxD
EMC Filter
100n
optinal for improving ESD Performance
10
GND
100p
optinal RC-EMC Filter
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TH3044
K-Bus Interface
1
14
NRXD RXD
GND VCC N.C. RXD TxD SEN/STA
2
13
1
8
GND VCC
3
12
2
7
4
TH3044
11
TxD SEN/STA
TH3044
BUS VBAT
3
6
5
10
4
5
BUS VBAT
6
9
7
8
SOIC 8
SOIC 14 NB
Pin SOIC14 Pin SOIC 8
3 4 6 7 10 11 13 14 1 2 3 4 5 6 7
Name
GND VCC BUS VBAT SEN/STA TXD RXD NRXD
I/O
P I I/O P I/O I O O
Function
Ground Supply Voltage 5V K-Bus Battery Voltage Transmit Status Transmit Input Receive Output Inverted Receive Output
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TH3044
K-Bus Interface
DC ( SOIC14NB) Package Dimensions
E
H
123 D
A1 e b
A L
Small Outline Integrated Circiut (SOIC),
All Dimension in mm, coplanarity < 0.1 mm
D
SOIC 14 150 mil min max min max 8.55 8.75 0.337 0.334
E
3.80 4.00 0.150 0.157
H
5.80 6.20 0.228 0.224
A
1.35 1.75 0.053 0.069
A1
0.10 0.25 0.004 0.010
e
1.27
b
0.33 0.51 0.013 0.020
L
0.40 1.27 0.016 0.050
0 8 0 8
All Dimension in inch, coplanarity < 0.004" SOIC 14 150 mil 0.050
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TH3044
K-Bus Interface
SOIC8 Package Dimensions
Small Outline Integrated Circiut (SOIC),
All Dimension in mm, coplanarity < 0.1 mm
DC (SOIC 8, 150 mil)
D
min max 4.8 5.00
E
3.80 4.00
H
5.80 6.20
A
1.35 1.75
A1
0.10 0.25
e
1.27
b
0.33 0.51
L
0.40 1.27
0 8
All Dimension in inch, coplanarity < 0.004" min max 0.189 0.197 0.150 0.157 0.228 0.244 0.053 0.069 0.004 0.010 0.050 0.013 0.020 0.016 0.050 0 8
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TH3044
K-Bus Interface
!
Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and wave soldering with usual (63/37 SnPb-) solder (melting point at 183degC). The following test methods are applied: IPC/JEDEC J-STD-020A (issue April 1999) Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices CECC00802 (issue 1994) Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed Quality MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. For more information on manufacturability/solderability see quality page at our website: http://www.melexis.com/
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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TH3044
K-Bus Interface
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis' rendering of technical or other services. (c) 2002 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at:
www.melexis.com
Or for additional information contact Melexis Direct:
Europe and Japan: All other locations:
Phone: +32 13 67 04 95 E-mail: sales_europe@melexis.com Phone: +1 603 223 2362 E-mail: sales_usa@melexis.com
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QS9000, VDA6.1 and ISO14001 Certified
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